Reverse Costing Analysis of the iPhone 5S MEMS Gyroscope STMicroelectronics 3x3mm - kcentv.com - KCEN HD - Waco, Temple, and Killeen

Reverse Costing Analysis of the iPhone 5S MEMS Gyroscope STMicroelectronics 3x3mm

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SOURCE Research and Markets

DUBLIN, February 5, 2014 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/lxrnrn/iphone_5s_mems) has announced the addition of the "Reverse Costing Analysis of the iPhone 5S MEMS Gyroscope STMicroelectronics 3x3mm" report to their offering. 

     (Logo: http://photos.prnewswire.com/prnh/20130307/600769 )

STMicroelectronics 4x4mm MEMS gyro was integrated in the previous iPhones (iPhone 4, 4S & 5). For the new iPhone 5S, Apple has chosen the latest 3x3mm MEMS gyro from ST, thus achieving a 45% footprint reduction.

The new 3-Axis MEMS gyroscope is assembled with a true CSP process (Chip Scale Packaging) allowing a package efficiency of 75% (silicon area/package area). This packaging size reduction combined with dies shrinking allowed ST to reduce by 20% the production cost of their latest gyro.

This report provides a complete teardown of the MEMS gyro with:

  • Detailed photos
  • Material analysis
  • Comparison with iPhone 4/4S/5 gyro
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth manufacturing cost analysis
  • Supply chain evaluation
  • Selling price estimation

Key Topics Covered: 

Glossary

Overview/Introduction 

STMicroelectronics Company Profile

Physical Analysis

  • Physical Analysis Methodology
  • Package
  • Package Characteristics & Markings
  • Package Opening
  • Wire bonding process
  • Package Cross-Section
  • ASIC
  • ASIC Dimensions & Markings
  • ASIC Delayering
  • ASIC Cross-Section
  • ASIC Process Characteristics
  • MEMS
  • MEMS Dimensions & Markings
  • MEMS bonding pads
  • MEMS Cap Opening
  • MEMS Cap
  • MEMS Sensing Area
  • MEMS Cross-section

Comparison with iPhone 4/4S/5 Gyroscope

Manufacturing Process Flow

  • ASIC Process Flow
  • Description of the ASIC Wafer Fabrication Unit
  • MEMS Sensor Process Flow
  • MEMS Cap Process Flow
  • MEMS Wafer Bonding Process Flow
  • Description of the MEMS Wafer Fabrication Unit
  • Packaging Process Flow

Cost Analysis

  • Main Steps of Economic Analysis
  • Yields Hypotheses
  • ASIC Front-End Cost
  • ASIC Back-End 0 : Probe Test, Backgrinding & Dicing
  • ASIC Die Cost
  • MEMS Front-End Cost
  • MEMS Front-End Cost per Process Steps
  • MEMS Front-End : Equipment Cost per Family
  • MEMS Front-End : Material Cost per Family
  • MEMS Back-End 0 : Probe Test & Dicing
  • MEMS Die Cost (Front End + Back End 0)
  • Back-End : Packaging Cost
  • Back-End : Final test & Calibration Cost
  • Component Cost (FE + BE 0 + BE 1)
  • Comparison with iPhone 4/4S/5 Gyro Component Cost

Estimated Price Analysis 

For more information visit http://www.researchandmarkets.com/research/lxrnrn/iphone_5s_mems

Media Contact: Laura Wood, +353-1-481-1716, press@researchandmarkets.net

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