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SOURCE Research and Markets
DUBLIN, February 5, 2014 /PRNewswire/ --
Research and Markets (http://www.researchandmarkets.com/research/lxrnrn/iphone_5s_mems) has announced the addition of the "Reverse Costing Analysis of the iPhone 5S MEMS Gyroscope STMicroelectronics 3x3mm" report to their offering.
STMicroelectronics 4x4mm MEMS gyro was integrated in the previous iPhones (iPhone 4, 4S & 5). For the new iPhone 5S, Apple has chosen the latest 3x3mm MEMS gyro from ST, thus achieving a 45% footprint reduction.
The new 3-Axis MEMS gyroscope is assembled with a true CSP process (Chip Scale Packaging) allowing a package efficiency of 75% (silicon area/package area). This packaging size reduction combined with dies shrinking allowed ST to reduce by 20% the production cost of their latest gyro.
This report provides a complete teardown of the MEMS gyro with:
Key Topics Covered:
STMicroelectronics Company Profile
Comparison with iPhone 4/4S/5 Gyroscope
Manufacturing Process Flow
Estimated Price Analysis
For more information visit http://www.researchandmarkets.com/research/lxrnrn/iphone_5s_mems
Media Contact: Laura Wood, +353-1-481-1716, firstname.lastname@example.org
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