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SOURCE Research and Markets
DUBLIN, February 5, 2014 /PRNewswire/ --
Research and Markets (http://www.researchandmarkets.com/research/5mwbpk/bosch_sensortec) has announced the addition of the "Reverse Costing Analysis for the Bosch Sensortec BMG160 3-Axis MEMS Gyroscope" report to their offering.
(Logo: http://photos.prnewswire.com/prnh/20130307/600769 )
The first MEMS gyroscope of Bosch for Consumer Applications Employing a New Wafer Bonding Process
More than 10 years after the release of its MEMS gyroscopes for automotive, Bosch Sensortec release its first 3-Axis gyroscope for consumer applications.
In a market largely dominated by STMicroelectronics and InvenSense, Bosch Sensortec was the first to release a 3-axis MEMS gyroscope in a 3x3mm² package in order to gain market shares. Although the manufacturing process (Epi-poly surface micromachining) is similar to the one of automotive gyro, new processes for the capping and the wafer bonding has been adopted. Indeed, the classic "glass-frit" wafer bonding has been abandoned in favor of an eutectic bonding.
This report provides a complete teardown of the MEMS gyro with:
Key Topics Covered:
Bosch Company Profile
Manufacturing Process Flow
Estimated Price Analysis
For more information visit http://www.researchandmarkets.com/research/5mwbpk/bosch_sensortec
Media Contact: Laura Wood, +353-1-481-1716, firstname.lastname@example.org
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